Fujian, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
2003-01-24
Management System Certification:
ISO9001:2008, ISO14001:2004, TS16949, ISO13485:2003
Annual Revenue:
7.92 Million USD
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

Flexible Printed Circuits, Flexible PCB, PCB Assembly manufacturer / supplier in China, offering Multilayer Flexible Printed Circuit Board, FPC, High Quality Double Side FPCB PCB, Rigid Flexible Printed Circuit Board and so on.

Gold Member Since 2012
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Supplier Homepage Products Double-Sided Flex PCB Multilayer Flexible Printed Circuit Board, FPC

Multilayer Flexible Printed Circuit Board, FPC

Get Latest Price
Purchase Qty. / Reference FOB Price
1-999 Pieces US $5
1,000+ Pieces US $4
Production Capacity: 1, 000, 000 PCS/Year
Transport Package: Vacuum Package
Payment Terms: L/C, T/T
Type: Flexible Circuit Board
Dielectric: FR-4
Material: Paper Phenolic Copper Foil Substrate
Flame Retardant Properties: V0
Mechanical Rigid: Fexible
Processing Technology: Electrolytic Foil

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Basic Info

Model NO.: S102874
Base Material: Copper
Insulation Materials: Organic Resin
Model: PCB
Brand: LX
ISO9001:2008: Quality Management Qualification
ISO/Ts 16949: Automotive
ISO 13485: Medical Devices
ISO 14001: Environmental Qualification
Trademark: Blank
Specification: RoHs
Origin: China
HS Code: 85340090

Product Description


1. Over 10 years'manufacturing experience focus on flexible circuit industry area.
2. Assembly provided.
3. 100% quality tested before shipment.
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted.
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc

 

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
 

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