Fujian, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
Management System Certification:
ISO9001:2008, ISO14001:2004, TS16949, ISO13485:2003
Annual Revenue:
7.92 Million USD
OEM/ODM Availability:
OEM/ODM Service
Sample Available

FPC, Flexible Printed Circuit Board, Multilayer FPC manufacturer / supplier in China, offering High Quality 6 Layers Multilayer FPC, High Quality Double Side FPCB PCB, Rigid Flexible Printed Circuit Board and so on.

Gold Member Since 2012
Audited Supplier

High Quality 6 Layers Multilayer FPC

Get Latest Price
Purchase Qty. / Reference FOB Price
1-999 piece US $10
1,000+ piece US $9
Port: Xiamen, China
Transport Package: Vacuum
Payment Terms: L/C, T/T
Structure: Multilayer FPC
Material: Polyimide
Combination Mode: Adhesive Flexible Plate
Application: Digital Products
Conductive Adhesive: Conductive Silver Paste
Flame Retardant Properties: V0

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Basic Info

Model NO.: M7453
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Brand: FPC
Dimensions: 110 X 32mm
Surface Treatment: Enig
Line Width/Space: 0.15mm/0.15mm
Au: 0.03 to 0.09um
Ni: 2 to 6um
Outline Tolerance: ±0.2mm
Cover Layer Tolerance: ±0.2mm
Minimum Hole Size: 0.2mm
Minimum Pitch: 0.15mm
Trademark: blank
Specification: RoHS, SGS
Origin: Xiamen
HS Code: 85340090

Product Description


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Xiamen BOLION Workshop Capability
Material Cutting
Max dimension of material cutting250MM× 450MM250MM× 10000MM
Min dimension of material cutting250MM× 100MM
Auto-machine cutting tolerance± 1MM
Manually cutting tolerance± 2MM
Mechanical Drilling
Min drill Dia.Dia. 0.20MMDia. 0.15MM
Max drill Dia.Dia. 6.35MM
Min drill space0.15MM0.125MM
Drill hole Dia. tolerance± 0.05 MM
Laser Drilling
Min drill Dia.Dia. 0.15MMDia. 0.1MM
Max drill Dia.Dia. 6.35MM
Min drill space0.1MM
Drill hole Dia. tolerance± 0.02 MM
Copper plating
Copper plating capacity(thickness of hole plating)8-15um; 20-30 um (± 5um' s distribution)30-70 um
Max PNL dimension for PTH250MM× 350MM250MM× 2000MM
Aspect ratio (= board thickness / min via diameter)2 max for 0.10 mm vias3 max for 0.10 mm vias
4 max for 0.15 mm vias5 max for 0.15 mm vias
6 max for 0.20 mm vias7 max for 0.20 mm vias
8 max for 0.25 mm vias9 max for 0.25 mm vias
Blue photosensitive etching-resist ink (Silkscreen)
Max PNL dimension of screen printer300× 450MM250MM× 2000MM
Thickness of photo image ink15-20um10-40um
Dry film
Max production dimension of dry film250MM× 350MM330MM× ∞   MM
Thickness of dry film30um20um; 40um; 50um
Space between pads and line (panel plating)≥ 0.15MM≥ 0.10MM
Space between pads and line (via pads pattern plating)≥ 0.30MM≥ 0.20MM
Layer to layer misregistration tollerance0.2MM0.10MM
Min size of square solder mask opening0.40MM× 0.40MM
Min circular solder mask open sizeDia. 0.35MM
Min width of solder mask0.15MM0.10MM
Solder mask bridge aspect ratio (=length/width)10 max for 0.10 mm width15 max for 0.10 mm width
15 max for 0.15 mm width20 max for 0.15 mm width
20 max for 0.20 mm width25 max for 0.20 mm width
Space between solder mask open and trace0.1mm0.05mm
Max PNL size on exposure machine250MM× 350MM600MM× 750MM; 600MM× 10000MM (Space > 0.3MM)
Min dimension of non-PTH circular padDia. 0.3MMDia. 0.2MM
Min anular ring width of PTH pad0.125MM0.10MM
Max production size of etching250MM× 350MM500MM× ∞
Min trace & space width0.06± 0.01 MM (copper thickness: 12 um)0.05± 0.01 MM (copper thickness: 12 um)
0.075± 0.015 MM (copper thickness: 18 um)0.065± 0.015 MM (copper thickness: 18 um)
0.1± 0.02 MM (copper thickness: 25~35 um)0.085± 0.02 MM (copper thickness: 25~35 um)
0.1± 0.03 MM (copper thickness: 35~45 um)0.085± 0.02 MM (copper thickness: 25~35 um)
Coverlay alignment
Coverlay alignment tolerance± 0.30 MM (manually operating)± 0.20 MM
± 0.20 MM (fixturally operating)± 0.0.15 MM
Min space between opening and pad0.2MM0.15MM
Overlap of coverlay opening and iland finger or pads0.5 MM0.3 MM for Circular pads
PNL size on quick press250MM× 400 MM340MM× 5000MM
PNL size on traditional vacuum press630× 550MM
Adhesive squeeze when laminatingQuick press: 6± 2mil
Vacuum press: 3± 1mil
Legend ink colorwhite, blackPer request
solder mask colorYellow, green, amberPer request
silver/carbon pastes colorsilver pastes: silver; carbon pastes: black
Working size of silkscreen table350 MM× 700 MM250MM× 2000MM
Min character width0.125 MM0.10 MM
Min character height0.80 MM0.70 MM
Space between character and pad opening0.5 MM0.3 MM
Silkscreen alignment tolerance± 0.30MM± 0.20 MM
Silkscreen silver pastes tolerance  ± 0.50MM± 0.40 MM
Silkscreen solder mask tolerance± 0.50MM± 0.30 MM
Min distance between silkscreen to outline0.3 MM
Min distance between silkscreen to NPTH0.3 MM
Printed ink thicknessLegend character: 8-15 um
Solder mask: 15-25 um
Silver ink: 10~25 um
Carbon ink: 10-20um
Carbon ink: 10-20um
Final finshing
ContentNormal coating thickness  Normal PNL size
Plating nickel gold (In house)Ni: 2-9um; Au: 0.03-0.09um300mm× 400 MM
Plating hard gold (In house)Ni: 2-9um; Au: 0.1-1.0um300mm× 400 MM
Plating soft gold (In house)Ni: 2-9um; Au: 0.03-0.09um300mm× 400 MM
Plating pure tin (In house)2.0-8.0um300mm× 400 MM
Immersion Tin (In house)0.3-0.6um300mm× 400 MM
OSP (In house)N/A300mm× 400 MM
ENIG (Hard Nickel)  (In house)Ni: 2-6um; Au: 0.03-0.10um300mm× 400 MM
ENIG (Soft Nickel)  (In house)Ni: 2-6um; Au: 0.03-0.10um300mm× 400 MM
ENEPIG (Hard Nickel)  (In house)Ni: 2-6um; Au: 0.03-0.10um300mm× 400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm× 400 MM
Immersion silver (Outsource)Per standand creteria300mm× 400 MM
Electrical test (Flying probe tester for sample)
Max test points qty4096
Min probe0.25MM0.15MM
Max probe1.70MM
Safe distance between test probes0.20MM
Stiffener, PSA alignment tolerance
Min safe space between alignments and pads opening± 0.50 MM± 0.30 MM
Tolerance without hole-centered alignments± 0.40 MM± 0.40 MM
Tolerance with hole-centered alignments± 0.2 MM
Min strip width of PSA2MM1.0 MM
Min seperate PSA size13× 2.0 MM
Die cutting
Outline manually cutting (Outline length≤ 100MM)± 0.20 MM (Need manually cut guide line)
Outline manually cut (Outline length > 100MM)± 2 ‰
Outline soft tooling cut (Outline length≤ 100MM)± 0.20 MM
Outline soft tooling cut (Outline length > 100MM)  ± 2‰
Outline etching die cut (Outline length≤ 100MM)± 0.10 MM
Outline etching die cut (Outline length > 100MM)± 1.5‰
Outline normal hard tooling cut (L< 100MM)± 0.10 MM
Outline normal hard tooling cut (100≤ L< 150MM)± 0.15 MM
Outline normal hard toolingcut (L≥ 150MM)± 1.5‰± 1.3‰
Outline precise hard tooling cut (L< 100MM)± 0.05 MM
Outline precise hard tooling cut (100≤ L< 150MM)± 0.1 MM
Outline precise hard toolingcut (L≥ 150MM)± 1.2‰± 1.0‰
Outline segmented cut± 1.5‰ (soft tooling)
Min punching hole Dia. and toleranceDia. 0.60 ± 0.05 MM
Tolerance for hole to board edge1.0 MM(normal soft die cut tooling)0.50 MM(Etching die cut tooling, normal hard tooling)
Tolerance for trace center to board edge0.10 MM0.08 MM(precise hard tooling)

TrayPer product size
Low viscosity PET layer300× 210MM
Ziplock bagPer product size
Vacuum sealing package16cmx23cm, 20cmx34cm,28cmx36cm, 30cmx50cm

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