Fujian, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
2003-01-24
Management System Certification:
ISO9001:2008, ISO14001:2004, TS16949, ISO13485:2003
Annual Revenue:
7.92 Million USD
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

Wearable, Wireless, Intelligent Electronic Device manufacturer / supplier in China, offering Finger Sculptured FPC Flex Circuit PCB, High Quality Double Side FPCB PCB, Rigid Flexible Printed Circuit Board and so on.

Gold Member Since 2012
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  • Finger Sculptured FPC Flex Circuit PCB
  • Finger Sculptured FPC Flex Circuit PCB
  • Finger Sculptured FPC Flex Circuit PCB

Finger Sculptured FPC Flex Circuit PCB

Get Latest Price
Purchase Qty. / Reference FOB Price
1-9,999 Pieces US $10
10,000+ Pieces US $8
Port: Xiamen, China
Transport Package: Vacuum Package
Payment Terms: L/C, T/T
Structure: Double-Sided FPC
Material: Polyimide
Combination Mode: Adhesive Flexible Plate
Application: Digital Products
Conductive Adhesive: N/a
Flame Retardant Properties: V0

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Basic Info

Model NO.: D8003
Processing Technology: Rolled Annealed Copper
Base Material: Copper
Insulation Materials: Epoxy Resin
Brand: Taiflex
Min.Space: 0.5mm
Min. Line: 0.5mm
Min. Pth: 25um
Aspect Tatio: N/a
Impedance: N/a
Stiffener: Fr4
Surface Treatment: Immersion Tin
Specification: RoHs
Origin: China
HS Code: 85340090

Product Description


1. Over 10 years'manufacturing experience focus on flexible circuit industry area.
2. Assembly provided.
3. 100% quality tested before shipment.
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted.
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Finger Sculptured FPC Flex Circuit PCB
Finger Sculptured FPC Flex Circuit PCB

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM

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