Fujian, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
2003-01-24
Management System Certification:
ISO9001:2008, ISO14001:2004, TS16949, ISO13485:2003
Annual Revenue:
7.92 Million USD
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

PCB Assembly, PCB Design, Air Cleaner manufacturer / supplier in China, offering Flex Rigid PCB Flexible PCB, High Quality Double Side FPCB PCB, Rigid Flexible Printed Circuit Board and so on.

Gold Member Since 2012
Audited Supplier
  • Flex Rigid PCB Flexible PCB
  • Flex Rigid PCB Flexible PCB

Flex Rigid PCB Flexible PCB

Get Latest Price
Purchase Qty. / Reference FOB Price
1-99,999 Pieces US $0.3
100,000+ Pieces US $0.2
Port: Xiamen, China
Transport Package: Vacuum Package
Payment Terms: L/C, T/T
Type: Flexible Circuit Board
Material: Paper Phenolic Copper Foil Substrate
Flame Retardant Properties: V0
Mechanical Rigid: Fexible
Processing Technology: Electrolytic Foil
Base Material: Copper

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Basic Info

Model NO.: B10187
Insulation Materials: Organic Resin
Model: PCB
Brand: ZH
Min.Space: 0.175mm
Min. Line: 0.127mm
Min. Pth: N/a
Stiffener: N/a
Surface Treatment: Hard Gold
ISO9001:2008: Quality Management Qualification
ISO/Ts 16949: Automotive
ISO 13485: Medical Devices
ISO 14001: Environmental Qualification
Specification: RoHs
Origin: China
HS Code: 85340090

Product Description


1. Over 10 years'manufacturing experience focus on flexible circuit industry area.
2. Assembly provided.
3. 100% quality tested before shipment.
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted.
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Flex Rigid PCB Flexible PCB
Flex Rigid PCB Flexible PCB

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM

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