Fujian, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
2003-01-24
Management System Certification:
ISO9001:2008, ISO14001:2004, TS16949, ISO13485:2003
Annual Revenue:
7.92 Million USD
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

Flexible PCB, Printed Circuit Board, PCB manufacturer / supplier in China, offering Multilayer PCB Manufacturing, High Quality Double Side FPCB PCB, Rigid Flexible Printed Circuit Board and so on.

Gold Member Since 2012
Audited Supplier

Multilayer PCB Manufacturing

Get Latest Price
Purchase Qty. / Reference FOB Price
10-99 Pieces US $3
100+ Pieces US $2
Payment Terms: L/C, T/T
Structure: Multilayer FPC
Material: Polyimide
Combination Mode: Adhesive Flexible Plate
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Car, Auto Device etc..
Conductive Adhesive: Conductive Silver Paste
Flame Retardant Properties: V0

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Basic Info

Model NO.: R10441
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Layers: 2
Dimensions: 53 X 103mm
Minimum Hole Size: 0.1mm
Thickness: 1.6mm
Line Width/Space: 0.7/0.3mm
Tg: 140 Oc
Silkscreens: Legendx2
Surface Treatment:Enig: Au: 0.03 to 0.09um, Ni: 2 to 6um
Origin: Xiamen
HS Code: 85340090

Product Description


1. Over 10 years'manufacturing experience focus on flexible circuit industry area.
2. Assembly provided.
3. 100% quality tested before shipment.
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted.
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc

 

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
 

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