Fujian, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
2003-01-24
Management System Certification:
ISO9001:2008, ISO14001:2004, TS16949, ISO13485:2003
Annual Revenue:
7.92 Million USD
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

Rigid-Flex PCB, Hybrids Circuit Board, 4 Layers PCB manufacturer / supplier in China, offering Electronic Device Usage, 4-Layer Rigid-Flex PCB,, High Quality Double Side FPCB PCB, Rigid Flexible Printed Circuit Board and so on.

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Supplier Homepage Products Rigid Flex PCB Electronic Device Usage, 4-Layer Rigid-Flex PCB,

Electronic Device Usage, 4-Layer Rigid-Flex PCB,

Get Latest Price
Min. Order: 10 piece
Port: Xiamen, China
Transport Package: Vacuum
Payment Terms: L/C, T/T
Structure: Multilayer FPC
Dimensions: 178.04 X 47.06mm
Surface: Enig
Specification: ROHS
Trademark: blank
Origin: China

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Basic Info

Model NO.: R9435
HS Code: 85340010

Product Description

 R9435
High-quality 4-layer Rigid-flex PCB, Used for Electronic Device
Dimensions: 178.04 x 47.06mm
Line width/space: 0.2mm/0.2mm
Base materials: 1.4mil Cu/0.8mil ADH/1mil PI, 1.4mil Cu/1.2mm FR4
Cover layer: 1mil ADH/1mil PI green oil
Surface treatment: (Au: 0.03 to 0.09um, Ni: 2 to 6um)
Outline tolerance: ±0.2mm
Cover layer tolerance: ±0.3mm

advantage:


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc


 

Electronic Device Usage, 4-Layer Rigid-Flex PCB,
Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM

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