Gold Member Since 2012
Audited Supplier
Xiamen Bolion Tech. Co., Ltd.

Flexible PCB, Printed Circuit Board, PCB manufacturer / supplier in China, offering Multilayer PCB Manufacturing, Double-Sided Flexible PCB 1022, Rigid Flexible PCB RoHS Enig and so on.

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Supplier Homepage Product Rigid Flex PCB Multilayer PCB Manufacturing

Multilayer PCB Manufacturing

Purchase Qty.:
(Pieces)
10-99 100+
FOB Unit Price: US $3 US $2
Purchase Qty. (Pieces) FOB Unit Price
10-99 US $3
100+ US $2
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Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: R10441
  • Material: Polyimide
  • Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Car, Auto Device etc..
  • Flame Retardant Properties: V0
  • Base Material: Copper
  • Layers: 2
  • Minimum Hole Size: 0.1mm
  • Line Width/Space: 0.7/0.3mm
  • Silkscreens: Legendx2
  • Origin: Xiamen
  • Structure: Multilayer FPC
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Dimensions: 53 X 103mm
  • Thickness: 1.6mm
  • Tg: 140 Oc
  • Surface Treatment:Enig: Au: 0.03 to 0.09um, Ni: 2 to 6um
  • HS Code: 85340090
Product Description

1. Over 10 years'manufacturing experience focus on flexible circuit industry area.
2. Assembly provided.
3. 100% quality tested before shipment.
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted.
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc

 

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
 
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