Gold Member Since 2012
Audited Supplier
Xiamen Bolion Tech. Co., Ltd.

Rigid-Flex Board, Hybrids Circuit Board, 2 Layers PCB manufacturer / supplier in China, offering Rigid Circuit and Flex Circuit Hybrid Board, Double-Sided Flexible PCB 1014, Flexible Printed Circuit Board with Pi Stiffener and Enig and so on.

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Rigid Circuit and Flex Circuit Hybrid Board

Purchase Qty.:
(Pieces)
20-199 200-499 500+
FOB Unit Price: US $7.88 US $6.52 US $5.77
Purchase Qty. (Pieces) FOB Unit Price
20-199 US $7.88
200-499 US $6.52
500+ US $5.77
Get Latest Price
Port: Xiamen, China
Production Capacity: 1, 000, 000 PCS/Year
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: R9703
  • Material: Fr4+Pi
  • Application: Digital Products
  • Flame Retardant Properties: V0
  • Base Material: Copper
  • Brand: FPC
  • Surface: Enig
  • ISO/Ts16949: Automotive
  • ISO14001: Environmental Qualification
  • Trademark: blank
  • Specification: ROHS
  • HS Code: 85340010
  • Structure: Hybrids Circuit Board
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Processing Technology: Delay Pressure Foil
  • Insulation Materials: Epoxy Resin
  • Dimensions: 53 X 103mm
  • ISO9001:2008: Quality Management Qualification
  • ISO13485: Medical Device
  • UL: E228871
  • Transport Package: Vacuum
  • Origin: China
Product Description
 Model :R9307

Dimensions: 53 x 103mm
Line width/space: 0.7/0.3mm
Base material: 1.4 mils Cu/0.8 mils ADH/1 mil PI, 1.4 mils Cu/1.4mm FR4
Cover layer: 1 mil ADH/1 mil PI green oil
Surface treatment: ENIG, (Au: 0.03 to 0.09um, Ni: 2 to 6um)
Outline tolerance: ±0.2mm
Cover layer tolerance: ±0.3mm
Minimum hole size: 0.1mm
Minimum pitch: 0.15mm

advantage:


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc


 

Rigid Circuit and Flex Circuit Hybrid Board
Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
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