Gold Member Since 2012
Audited Supplier
Xiamen Bolion Tech. Co., Ltd.

Rigid-Flex Board, Hybrids Circuit Board, 2 Layers PCB manufacturer / supplier in China, offering Rigid Circuit and Flex Circuit Hybrid Board, Single Side Flexible Printed Circuit Board, Double -Side Flexible Printed Circuit Board and so on.

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Rigid Circuit and Flex Circuit Hybrid Board

Purchase Qty.:
(Pieces)
20-199 200-499 500+
FOB Unit Price: US $7.88 US $6.52 US $5.77
Purchase Qty. (Pieces) FOB Unit Price
20-199 US $7.88
200-499 US $6.52
500+ US $5.77
Get Latest Price
Port: Xiamen, China
Production Capacity: 1, 000, 000 PCS/Year
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: R9703
  • Material: Fr4+Pi
  • Application: Digital Products
  • Flame Retardant Properties: V0
  • Base Material: Copper
  • Brand: FPC
  • Surface: Enig
  • ISO/Ts16949: Automotive
  • ISO14001: Environmental Qualification
  • Trademark: blank
  • Specification: ROHS
  • HS Code: 85340010
  • Structure: Hybrids Circuit Board
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Processing Technology: Delay Pressure Foil
  • Insulation Materials: Epoxy Resin
  • Dimensions: 53 X 103mm
  • ISO9001:2008: Quality Management Qualification
  • ISO13485: Medical Device
  • UL: E228871
  • Transport Package: Vacuum
  • Origin: China
Product Description
 Model :R9307

Dimensions: 53 x 103mm
Line width/space: 0.7/0.3mm
Base material: 1.4 mils Cu/0.8 mils ADH/1 mil PI, 1.4 mils Cu/1.4mm FR4
Cover layer: 1 mil ADH/1 mil PI green oil
Surface treatment: ENIG, (Au: 0.03 to 0.09um, Ni: 2 to 6um)
Outline tolerance: ±0.2mm
Cover layer tolerance: ±0.3mm
Minimum hole size: 0.1mm
Minimum pitch: 0.15mm

advantage:


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc


 

Rigid Circuit and Flex Circuit Hybrid Board
Rigid Circuit and Flex Circuit Hybrid Board
Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
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