Gold Member Since 2012
Audited Supplier
Xiamen Bolion Tech. Co., Ltd.

Circuit Sticker, Internet of Things, FPC manufacturer / supplier in China, offering Green Ink Solder Mask Multilayer FPC, Single Side Flexible Printed Circuit Board, Double -Side Flexible Printed Circuit Board and so on.

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Green Ink Solder Mask Multilayer FPC

Purchase Qty.:
(piece)
10-99 100-999 1,000-9,999 10,000+
FOB Unit Price: US $9.546 US $9.125 US $8.749 US $7.549
Purchase Qty. (piece) FOB Unit Price
10-99 US $9.546
100-999 US $9.125
1,000-9,999 US $8.749
10,000+ US $7.549
Get Latest Price
Transport Package: Vacuum Package
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: M7941A
  • Material: Polyimide
  • Application: Digital Products
  • Flame Retardant Properties: V0
  • Base Material: Copper
  • Dimensions: 81.36mm*75.73mm
  • Trademark: Bolion
  • Origin: China
  • Structure: Multilayer FPC
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Surface Treatment: Enig
  • Specification: Multilayer
  • HS Code: 85340090
Product Description

 M7941A
Dimension:81.36mm*75.73mm
Line Width/Space: 0.2mm/0.2mm
Base Material: 0.5oz Cu(RA), 1.0mil PI, 0.5oz Cu, 1mil PI,0.5oz Cu
Coverlayer: 1mil PI, 1mil ADH/ Green Oil
Stiffener: PI/FR4
Surface Treatment: ENIG: Au: 0.076-0.25um, Ni 2-5um
Line Width Tolerance: +/-0.05
Hole Tolerance: +/-0.076

 

Advantage:


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Green Ink Solder Mask Multilayer FPC
Green Ink Solder Mask Multilayer FPC

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
 
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