Gold Member Since 2012
Audited Supplier
Xiamen Bolion Tech. Co., Ltd.

Circuit Sticker, Internet of Things, FPC manufacturer / supplier in China, offering Green Ink Solder Mask Multilayer FPC, Double-Sided Flexible PCB 1022, Rigid Flexible PCB RoHS Enig and so on.

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Green Ink Solder Mask Multilayer FPC

Purchase Qty.:
(piece)
10-99 100-999 1,000-9,999 10,000+
FOB Unit Price: US $9.546 US $9.125 US $8.749 US $7.549
Purchase Qty. (piece) FOB Unit Price
10-99 US $9.546
100-999 US $9.125
1,000-9,999 US $8.749
10,000+ US $7.549
Get Latest Price
Port: Xiamen, China
Transport Package: Vacuum Package
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: M7941A
  • Material: Polyimide
  • Application: Digital Products
  • Flame Retardant Properties: V0
  • Base Material: Copper
  • Dimensions: 81.36mm*75.73mm
  • Trademark: Bolion
  • Origin: China
  • Structure: Multilayer FPC
  • Combination Mode: Adhesive Flexible Plate
  • Conductive Adhesive: Conductive Silver Paste
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Surface Treatment: Enig
  • Specification: Multilayer
  • HS Code: 85340090
Product Description

 M7941A
Dimension:81.36mm*75.73mm
Line Width/Space: 0.2mm/0.2mm
Base Material: 0.5oz Cu(RA), 1.0mil PI, 0.5oz Cu, 1mil PI,0.5oz Cu
Coverlayer: 1mil PI, 1mil ADH/ Green Oil
Stiffener: PI/FR4
Surface Treatment: ENIG: Au: 0.076-0.25um, Ni 2-5um
Line Width Tolerance: +/-0.05
Hole Tolerance: +/-0.076

 

Advantage:


1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
   Urgent case or spread delivery schedule will be updated per negociation then

FPC Apply:

medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Green Ink Solder Mask Multilayer FPC

Main Technique Index
DescriptionParameters
PolyimidePolyester
Base film Thickness (um)12.5,25,35,5012.5,25,35,50
Copper Thickness (um)12,17.5,35,50,70,105
Min. Line Width/Line Space (mm)0.075/0.075
Min. Hole Size (mm)0.15
Tolerance (mm)Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm)Above 1.0Above 0.8
Solder Resistance260C 10 seconds204C 5 seconds

 

 

 
Surface Treatment
ContentNormal coating thickness Normal PNL size
Plating nickel gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating hard gold (In house)Ni:2-9um;Au:0.1-1.0um300mm×400 MM
Plating soft gold (In house)Ni:2-9um;Au:0.03-0.09um300mm×400 MM
Plating pure tin (In house)2.0-8.0um300mm×400 MM
Immersion Tin (In house)0.3-0.6um300mm×400 MM
OSP (In house)N/A300mm×400 MM
ENIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENIG (Soft Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
ENEPIG (Hard Nickel)  (In house)Ni:2-6um;Au:0.03-0.10um300mm×400 MM
HASL (Outsource)Cover the pads with min thickness 1~2 um300mm×400 MM
Immersion silver (Outsource)Per standand creteria300mm×400 MM
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