Product List
(Total 0 Product )
View:
List View
Gallery View
FOB Price: US $3-4 / Piece
Min. Order: 1 Piece
- Structure: Single-Sided FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Digital Products
- Conductive Adhesive: N/a
- Flame Retardant Properties: V0
FOB Price: US $0.1 / Piece
Min. Order: 1 Piece
- Structure: Single-Sided FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical Devices
- Conductive Adhesive: N/a
- Flame Retardant Properties: V0
FOB Price: US $0.1 / piece
Min. Order: 1 piece
- Structure: Multilayer FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
- Conductive Adhesive: Anisotropic Conductive Adhesive
- Flame Retardant Properties: V0
Min. Order: 1 Piece
- Structure: Single-Sided FPC
- Material: Polyimide
- Combination Mode: Without Adhesive Flexible Plate
- Application: Digital Products
- Conductive Adhesive: Conductive Silver Paste
- Flame Retardant Properties: V0
Min. Order: 1 Piece
- Structure: Single-Sided FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Aviation and Aerospace
- Processing Technology: Delay Pressure Foil
- Base Material: Copper
FOB Price: US $9-10 / Piece
Min. Order: 1 Piece
- Structure: Multilayer FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Digital Products
- Conductive Adhesive: Conductive Silver Paste
- Flame Retardant Properties: V0
FOB Price: US $8.56-10 / Piece
Min. Order: 1 Piece
- Insulation Materials: Organic Resin
- Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
- Layer: 4
- Max Layer: 10
- Min Hole: 0.1mm
- Min Pitch: 0.15mm
FOB Price: US $1.5-2 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Flame Retardant Properties: V0
- Base Material: Copper
- Insulation Materials: Organic Resin
- Processing Technology: Electrolytic Foil
- Application: Communication
FOB Price: US $4-5 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
- Base Material: Copper
FOB Price: US $1.5-2 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Flame Retardant Properties: V0
- Base Material: Copper
- Insulation Materials: Organic Resin
- Processing Technology: Electrolytic Foil
- Application: Communication
FOB Price: US $4.252-5.478 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
- Base Material: Copper
FOB Price: US $4.252-5.478 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
- Base Material: Copper
FOB Price: US $4.252-5.478 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
- Base Material: Copper
FOB Price: US $1.5-2 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Flame Retardant Properties: V0
- Base Material: Copper
- Insulation Materials: Organic Resin
- Processing Technology: Electrolytic Foil
- Application: Communication
FOB Price: US $4-5 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Dielectric: FR-4
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
FOB Price: US $1.5-2 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Flame Retardant Properties: V0
- Base Material: Copper
- Insulation Materials: Organic Resin
- Processing Technology: Electrolytic Foil
- Application: Communication
FOB Price: US $5-8 / Piece
Min. Order: 10 piece
- Structure: Multilayer FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Aviation and Aerospace
- Conductive Adhesive: Conductive Silver Paste
- Flame Retardant Properties: V0
FOB Price: US $4-5 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Dielectric: FR-4
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
FOB Price: US $4-5 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Material: Paper Phenolic Copper Foil Substrate
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
- Processing Technology: Electrolytic Foil
- Base Material: Copper
FOB Price: US $4-5 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Dielectric: FR-4
- Material: Paper Phenolic Copper Foil Substrate
- Application: Aerospace
- Flame Retardant Properties: V0
- Mechanical Rigid: Fexible
FOB Price: US $2-3 / piece
Min. Order: 10 piece
- Structure: Double-Sided FPC
- Material: Polyimide
- Combination Mode: Adhesive Flexible Plate
- Application: Digital Products
- Conductive Adhesive: Conductive Silver Paste
- Flame Retardant Properties: V0
FOB Price: US $1.5-2 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Flame Retardant Properties: V0
- Base Material: Copper
- Insulation Materials: Organic Resin
- Processing Technology: Electrolytic Foil
- Application: Communication
FOB Price: US $1.5-2 / Piece
Min. Order: 1 Piece
- Type: Flexible Circuit Board
- Flame Retardant Properties: V0
- Base Material: Copper
- Insulation Materials: Organic Resin
- Processing Technology: Electrolytic Foil
- Application: Communication
Min. Order: 10 piece
- Dimension: 150mm*16mm
- Layer: 3
- Transport Package: Vacuum Package
- Specification: 3 layers FPC
- Trademark: blank
- Origin: China